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UMC

United Microelectronics Corp (ADRs) Price

Closed
UMC
$12.75
+$1.09(+9.34%)

*Data last updated: 2026-04-30 02:36 (UTC+8)

As of 2026-04-30 02:36, United Microelectronics Corp (ADRs) (UMC) is priced at $12.75, with a total market cap of $31.80B, a P/E ratio of 14.74, and a dividend yield of 3.82%. Today, the stock price fluctuated between $12.10 and $13.39. The current price is 5.37% above the day's low and 4.77% below the day's high, with a trading volume of 25.33M. Over the past 52 weeks, UMC has traded between $8.29 to $13.39, and the current price is -4.77% away from the 52-week high.

UMC Key Stats

Yesterday's Close$11.66
Market Cap$31.80B
Volume25.33M
P/E Ratio14.74
Dividend Yield (TTM)3.82%
Dividend Amount$0.48
Diluted EPS (TTM)3.34
Net Income (FY)$41.71B
Revenue (FY)$237.55B
Earnings Date2026-07-29
EPS Estimate0.13
Revenue Estimate$2.05B
Shares Outstanding2.72B
Beta (1Y)1.011
Ex-Dividend Date2025-06-24
Dividend Payment Date2025-07-23

About UMC

United Microelectronics Corporation operates as a semiconductor wafer foundry in Taiwan, Singapore, China, Hong Kong, Japan, the United States, Europe, and internationally. The company provides circuit design, mask tooling, wafer fabrication, and assembly and testing services. It serves fabless design companies and integrated device manufacturers. United Microelectronics Corporation was incorporated in 1980 and is headquartered in Hsinchu City, Taiwan.
SectorTechnology
IndustrySemiconductors
CEOJason S. Wang
HeadquartersHsinchu City,None,TW
Official Websitehttps://www.umc.com
Employees (FY)19.01K
Average Revenue (1Y)$12.49M
Net Income per Employee$2.19M

United Microelectronics Corp (ADRs) (UMC) FAQ

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United Microelectronics Corp (ADRs) (UMC) is currently trading at $12.75, with a 24h change of +9.34%. The 52-week trading range is $8.29–$13.39.

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Hot Posts About United Microelectronics Corp (ADRs) (UMC)

ChainNewsAbmedia

ChainNewsAbmedia

04-27 09:24
By the end of April 2026, Taiwan’s memory and HBM-related stocks collectively erupted. Nanya Technology (2408) entered NVIDIA’s Vera Rubin supply chain, and its share price hit the daily limit after jumping sharply. This also pushed up Taiwan’s Google Trends most-searched terms, with “2408,” “high-bandwidth memory,” “Nanya Chip,” “G-Semicon,” and “Winbond” climbing one after another. This article summarizes the core drivers behind this round of HBM/DRAM gains and the specific benefit pathways for Taiwan suppliers, so readers can understand each company’s position in the supply chain at a glance. ## Core logic: AI servers consume 66% of global DRAM capacity This round of momentum is driven by the explosive demand from AI accelerators for HBM (high-bandwidth memory). HBM uses stacked DRAM packaging, and both the per-chip capacity and bandwidth are far higher than those of traditional DDR5. It is a standard configuration for accelerators such as NVIDIA H100/H200/Blackwell/Vera Rubin. After AI servers absorb about 66% of global DRAM capacity, DDR5, LPDDR, and niche DRAM all move into a structural shortage—this is also the fundamental reason consumer memory prices are rising against the trend. ## Nanya Technology (2408): Standard DRAM, just entered the Vera Rubin supply chain Nanya Technology focuses on standard DRAM. At the end of April 2026, reports emerged that it has entered the supply chain for NVIDIA’s next-generation Vera Rubin platform, making it the first Taiwan-listed company to be included. Investment firms estimate that Nanya’s EPS will triple to the NT$21 range in 2026, and reach NT$17 in 2027, reflecting earnings leverage from AI-driven procurement. The 10-nanometer-class (1B) process mass-production progress is a key point to watch—whether it can break into the DDR5 mainstream market will determine its future pricing power. ## Winbond (2344): Niche DRAM + edge AI LPDDR Winbond’s product mix leans toward niche memory (Specialty DRAM) and NOR Flash, with a focus on automotive, industrial control, and IoT. This round’s benefits come from AI PCs and AI phones demanding high-performance, low-power LPDDR, while Winbond’s penetration in edge AI devices is increasing. The market views it as a “secondary beneficiary that doesn’t directly consume HBM, but is boosted by displacement effects.” ## Module makers: ADATA (3260), AdataX (4967), Transcend, Apacer Memory module makers have a very high share of advanced applications in gaming, servers, and enterprise storage. When original equipment manufacturers (Nanya Technology, Micron, SK hynix, Samsung) prioritize shifting capacity to HBM, module makers face increased cost pressure for ordinary DRAM chips. However, this shows up as faster price increases on the sales side and an expansion in gross margin. ADATA and AdataX have continued to see their revenue mix from high-end gaming modules rise this quarter. ## Upstream silicon wafers: Globalwafers, G-Semicon HBM and DRAM capacity expansions both require 12-inch silicon wafers. After Nanya Technology entered NVIDIA’s Vera Rubin, the silicon-wafer supply side—Globalwafers (5483) and G-Semicon (6182)—also benefits in parallel. The characteristic of this supply chain is “capex kick-off → wafer demand rises → capacity becomes tight,” and this quarter G-Semicon’s operating momentum is clearly heating up. ## Observation points for SK hynix and Samsung Among the three major Korean DRAM makers, SK hynix stands out for issuing an approximately NT$30 million-per-person bonus in 2026 due to its HBM leadership, reflecting strong AI cash generation. By comparison, Samsung has once again reportedly been hit by factory strikes this month (Google Trends 4/27 shows searches for “Samsung strike”). The internal labor dynamics of the two Korean giants will directly affect the global HBM and DDR5 supply schedule, and indirectly lift Taiwan suppliers’ room to fill. ## Not a bubble: business-cycle swings and AI structural demand coexist Memory is fundamentally a highly cyclical sector, but the difference between this round and 2017 and 2021 is that “AI structural demand” and the “DRAM displacement effect” are operating along two axes at the same time. The next observation points are the Q1 26 financial reports of SK hynix, Micron, and Samsung (to be released in early May), and whether NVIDIA’s Vera Rubin actual ramp-up timetable continues into the first half of 2027. For Taiwan suppliers, at least, this wave of momentum should last until the third-quarter earnings to provide clear confirmation/a pullback signal. This article about the HBM supply-chain surge—Nanya Technology, Winbond, AdataX, ADATA, and Globalwafers—first appeared on Chain News ABMedia.
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ChainNewsAbmedia

ChainNewsAbmedia

04-20 08:34
The ongoing 2D NAND flash memory supply shortage crisis continues to worsen, and reports from the market suggest that United Microelectronics (2303) may take over SLC and MLC Flash foundry wafer orders. The news has driven the stock price up nearly 30% in just five trading days. However, industry insiders told 《DIGITIMES》 that United Microelectronics faces a “three shortages” predicament—talent, technology, and equipment—and may run into a bottleneck in the short term. 2D NAND faces a severe shortage—could United Microelectronics take over foundry orders? As Samsung (Samsung), Kioxia (Kioxia), and other international memory giants have successively shifted resources and concentrated them on 3D NAND, the supply gap for 2D NAND has quickly widened. This has pushed up prices of older SLC and MLC NAND process products at a rapid pace; the price increases for some SKUs are nearly tenfold, with the growth rate outpacing DRAM. Downstream players also revealed that MLC NAND quotations have been raised by 30% since just April. (Memory price rally cooling off? Institutions estimate the Q2 increase narrows to 30%, and further cools in the second half) Against this backdrop, the industry has begun seeking alternative supply sources. Taiwan’s leading semiconductor foundry company, United Microelectronics, has become a “memory-themed stock” that the market is chasing, because it has some idle production capacity. Outside reports further say that some Asian customers have proactively contacted United Microelectronics to explore the possibility of taking on SLC and MLC Flash foundry wafer production. United Microelectronics (2303) stock closed today at $76.90, up 27.11% over five days As the rumors spread rapidly, United Microelectronics’ stock price surged more than 27% within five trading days; however, a United Microelectronics spokesperson did not respond to this. United Microelectronics faces three major gaps—“talent, technology, and equipment”—and the industry admits: no solution in the short term However, multiple industry insiders privately told 《DIGITIMES》 that United Microelectronics’ prospects of moving into 2D NAND foundry work are far more difficult than the market imagines. Talent gap: 2D NAND engineers have “left the building” First, most of the veteran engineers who were responsible for tuning 2D NAND process equipment have either retired or left. Those who remain have all been transferred to 3D NAND mass production positions. At present, NAND makers are fully racing to develop 3D NAND in order to capture the AI server market; manpower has long been stretched thin, leaving no slack to provide technical team support for migrating 2D NAND processes. Technical capability: United Microelectronics’ memory development capability shows a serious gap Next, although United Microelectronics carried out memory-related R&D years ago, its core technical direction has long shifted away from the memory field. Re-entering would not only require large-scale resources; rebuilding capabilities for yield optimization and process tuning would also take a considerable amount of time. If United Microelectronics can only provide production capacity but cannot support process development for customers on its own, its actual contribution to profits would be quite limited. Equipment acquisition: older-generation equipment is almost impossible to obtain Finally, when major manufacturers upgrade to 3D NAND production lines, older-generation equipment has already been sold off or dismantled. The secondhand market is almost unable to find what is needed; even if equipment can be found, it is equally difficult to get maintenance parts and technical personnel. Kioxia previously also said publicly that shutting down 2D NAND production was not due to AI capacity crowding it out; rather, it was due to severely aged old equipment, excessively high maintenance costs, and related issues. If United Microelectronics chooses to purchase entirely new equipment to rebuild the production line, it is estimated to take one to two years, and the yield-rebuilding process is full of uncertainty—meaning the investment payback risk is extremely high. United Microelectronics adjusts wafer price upward; the 8-inch line could see an increase of up to 15% in the second half In addition, United Microelectronics has recently officially issued price-increase notices to customers and business partners, confirming that it will raise wafer foundry quotation starting in the second half of 2026. The company said that, starting from the first half of 2026, demand across multiple application areas—including communications, industrial, consumer electronics, and AI-related fields—will continue to be strong. Combined with comprehensive increases in raw material, energy, and logistics costs, it is indeed necessary to raise prices. Supply-chain players said that both the 8-inch and 12-inch product lines are within the scope of this round of price increases. Based on a production cycle of about 3.5 months, April orders will be the first to apply the new prices: the 8-inch wafer production line has a relatively higher increase of about 10% to 15%; the 12-inch production line (including processes such as 80nm, 55nm, 40nm) has an estimated increase of about 5% to 10%, and the increases will be implemented in tiers according to each customer’s shipment volumes. Industry observers noted that this round of price hikes is mainly intended to make up for the profit shortfall caused by past price cuts in mature processes. IC customers with long-term contracts (LTA) are less affected, and the increase is expected to be gradually passed on to downstream customers. The gap between market expectations and reality: near-term risks should not be ignored Now, although United Microelectronics’ idea of taking on 2D NAND foundry work looks promising, the three major obstacles—talent gap, technical gap, and equipment shortages—are all intertwined. In the short term, it may end up running into a bottleneck. In a market environment where the supply gap continues to expand and quotations continue to rise, United Microelectronics’ rapid stock surge reflects more the market’s enthusiasm for the theme than changes in fundamentals. Chain-news reminds investors that when following volatile themes such as memory, they still need to prudently assess the risk of the gap between expectations and reality. This article: Taking over memory foundry—United Microelectronics’ stock jumps 30% in five days! Industry warns of a “three-shortage” bottleneck: likely to get stuck in the short term; earliest appears at Chain News ABMedia.
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PureTA

PureTA

04-10 21:30
#semiconductors these are and will be the winner or any tech war $crdo $amsc $umc $asml $tsmc $simo $camt $snps
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