Shanghai Stock Exchange bond market has issued 142.8 billion yuan of Sci-Tech Innovation Bonds this year, an increase of 83% year-on-year.

People’s Finance and Information, March 31—As of March 30, the Shanghai Stock Exchange bond market had cumulatively issued 154 technology innovation bonds totaling 142.8 billion yuan within the year, with the issuance size up 83% year over year. From the perspective of issuers, there are high-tech enterprises such as China Information and Communications Technology and Huawei Qin (Huaqin) Technology, as well as technology innovation investment institutions such as Petrochemical Capital. From the perspective of issuance terms, the tech innovation bonds are all medium- and long-term bonds. Among them, eight companies issued 10-year long-dated tech innovation bonds amounting to 8.31 billion yuan, effectively matching the production, R&D, and investment cycles. From the intended use of the raised funds, tech innovation bonds are planned to focus on areas such as next-generation information technology, new materials, high-end equipment manufacturing, and new energy, among others.